Convection being a slower mechanism than conduction often means that using traditional conductive materials such as Aluminium or Copper can be useless if the design relies primarily on convection. This can be solved by adding a convection medium or by increasing surface area of the part. 

Our 4TECH^® conductive range allow designers to use thermoplastic compounds, therefore allowing complex shapes designed to increase surface area to assist in heat convection away from components.
 
The thermal conductivity can be optimised in our 4TECH^® grades by changing the type and orientation of the fillers used.  Grades can be formulated to give increased in-plane conductivity or through plane/perpendicular conductivity.

Using 4TECH^® Thermally Conductive compounds we can design a material that offers either Electrically or Thermally conductive properties such as :  

• In plane thermal conductivity coefficient up to 30 W/mK
• Anti-static dissipation
• Flame retardant if required
• EMI/RF Shielding

Or Electrically Insulative & Thermally conductive properties such as :  

• Electrical Isolation
• Flame retardant if required
• No Carbon Tracking

These properties can be utilised using a wide range of polymer base to ensure products designed for you and your customers specific requirements.